AI Conference All-in-One Machine, supporting multiple meeting scenarios and real-time translation
Features
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Native HDMI input interface makes conference screen projection more stable and convenient; Dual 4K video output interfaces support dual-screen different display.
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Various mature Turnkey hardware solutions (Video Bar, conference box, conference display, conference docking station, etc.) support rapid product development and implementation.
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8M + 4M ISP independent parameter adjustment and optimization, supporting wide-angle + telephoto cameras; 6.75 Tops NPU, supporting algorithms for conference scenarios such as focusing on speakers, real-time voice-to-text conversion, and real-time translation.
Appearance
Parameters
| Process Technology | • 12nm FinFET |
| CPU | • Quad-core 64-bit ARM Cortex-A73 @ up to 2.1GHz |
| GPU |
• Imagination PowerVR Series9XE GE9920 GPU • Supports OpenGL ES 1.1/2.0/3.0/3.1/3.2, DirectFB/OpenCL 1.2, Vulkan 1.1 • Full 3D graphics acceleration • 5.6 GPixels/s fill rate, 200 MPolygons/s geometry performance • 89.6 GFLOPS (16-bit), 44.8 GFLOPS (32-bit) floating-point performance |
| NPU | • Up to 6.75 TOPS (INT8 precision) |
| Multimedia |
• 2160p60 video decoder (H.265/HEVC, H.264/AVC, VP9, VP8, AV1, MPEG-2) • Picture-in-Picture (2160p60+2160p60), Multi-View support • Dual-channel 1080p60 video encoder (H.264, VP8) |
| Display |
• MIPI-DSI v1.2 interface supports 4K@30Hz output • HDMI 2.1 transmitter with 4K@60Hz support and HDCP 2.2 content protection |
| Camera |
• MIPI-CSI v1.2 interface supports 4K@60Hz input • HDMI 2.1 receiver with 4K@60Hz input capability |
| Security |
• Dedicated 250MHz security subsystem (ARM Cortex-M3 core) • Secure boot, secure video path, on-chip 32Kbit OTP memory |
| Memory |
• 64-bit LPDDR4/LPDDR4x memory controller @ 3733MHz, supports up to 4GB • Optional 32-bit memory configuration supported • eMMC 5.1 flash storage interface |
| Interfaces |
• Integrated Image Signal Processor (ISP) supports dual-camera (8MP+4MP) input • Comprehensive I/O set: HDMI 2.1, MIPI DSI/CSI, RGMII Ethernet, USB 3.0 Host, USB 2.0 OTG, I2S audio, SPI, I2C, S/PDIF, PCIe 2.0, UART, PWM, IR receiver |
| Package |
• 17×17mm FCBGA package with 0.4mm ball pitch
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| Status |
• Mass production available, commercial-grade
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